1/3 www.asb.co.kr november 2008 plerow tm ALN0836AT internally matched lna module the plerow tm aln-series is the compactly designed surface-mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite communi- cation terminals, catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. specifications parameter unit min typ max frequency range mhz 824 849 gain db 20 21 gain flatness db 0.2 0.3 noise figure db 0.55 0.6 output ip3 (1) dbm 27 28 s11 / s22 (2) db -12 / -10 output p1db dbm 14 15 switching time sec - supply current ma 40 50 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is -40 c to +85 c. 1) oip3 is measured with two tones at an output power of 0 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc others ground outline drawing (unit: mm) features s 21 = 21.2 db @ 824 mhz = 20.8 db @ 849 mhz nf of 0.55 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding considerations. 2. we recommend that the ground via holes be placed on the bottom of all ground pins fo r better rf and thermal performance, as shown in the drawing at the left side. description (recommended footprint) a ln0836at a sb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) website: www.asb.co.kr e-mail: sales@asb.co.kr tel: (82) 42-528-7223 fax: (82) 42-528-7222 asb inc., 4th fl. venture town bldg., 367-17 goijeong-dong, seo-gu, daejon 302-716, korea more information 1-stage single type typ. @ t = 25 c, v s = 5 v, freq. = 836 mhz, z o.sys =50 ohm solder stencil area specifications (in production)
2/3 www.asb.co.kr november 2008 plerow tm ALN0836AT internally matched lna module s-parameters noise figure oip3 p1db cdma rx 824~849 +5 v typical performance (measured) s-parameters & k factor
3/3 www.asb.co.kr november 2008 plerow tm ALN0836AT internally matched lna module 1) the tantal capacitor is optional and for bypa ssing the ac noise introduced from the dc supply. the capacitance value may be determined by customer?s dc supply status. 2) so-called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and bl ocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application frequency. application circuit recommended soldering reflow process evaluation board layout + - aln out in c1 c2 tantal capacitor v dc 20~40 sec 260 c 200 c 150 c 60~180 sec ramp-up (3 ? c/sec) ramp-down (6 c/sec) size 25 x 25mm in out +vcc (for aln-at, bt, t series ? 10x10mm)
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